|
Home
Products
Customer
Service
E-NewZ
About Us
Strategic Partners
Frequently asked questions
| |
Applications Gallery
 |
Suited for packaging of vehicle sensors, Macromelt®
low-pressure molding solution is composed of polyamide hot melt and
available in various formulations. Material and process solution
simultaneously encapsulates sensor's circuitry and forms outer shell
of component to enable self-contained, integrated component.
Available in amber or black, product is resistant to fluids found in
automotive environment.
|
 |
Over-mould is a
finger grip, strain relief, flex control and anti vibration seal
all-in-one.
Improves
use & reliability and reduces cost.
|
|
Encapsulated sensor is protected from
harsh environment and provides strain relief and fixings. |
|
Multi-connector module has no case. Instead pcb
is over-moulded to provide a robust component.
The flat surface is printed with logo and data to
create the finished product. |
|
USB memory stick is given extra appeal by
over-moulding an attractive shape and colour.
Identity marks are added to the mould. |
 |
The mould incorporates an external cavity, more
costly to create with other materials. Strain relief, protection,
reliability, aesthetic appeal, shape and cost reduction come
together in this component. |
 |
The insulation
properties of low pressure polyamide make it suitable for high
voltage applications.
Sometimes
protecting IP is also important: encapsulation can help.
|
|
Mechanical and electrical protection of small
wiring assemblies is fast and simple |
For more information on...
| Cavist |
Over moulding can replace housing, potting and encapsulating in just
one operation... |
|
|
| Macromelt |
Macromelts are engineering
hot-melt adhesives for industrial applications in various market segments... |
| |
|
| FAQ |
Frequently
asked questions on over
- moulding, Macromelt®
Materials,
Moulding
Process,
Moulding Machines & Mould sets. |
 |
